Gate Drives

Amantys Gate Drives are designed for high power, high availability applications such as railway traction, wind turbines and medium voltage motor drives. Featuring embedded PLD and software technology the gate drives communicate over the fibre optic link using Amantys Power Insight technology a capability unique to Amantys. This allows the power stack designer to optimise the performance of the stack by configuring and monitoring the gate drive in situ, whilst at the same time enabling normal operation.

Capable of driving a range of IGBT modules from different manufacturers without hardware changes, they reduce inventory for users who want flexibility in design and sourcing. Each gate drive is suitable for 2-level, 3-level and multi-level converters.

For 4500V and 6500V IGBT modules, Amantys supplies a high isolation DC-DC converter. The DC-DC converter is designed to comply with international standards including EN 50155 for railway applications and IEC 61800-5-1 for variable speed motor drives.

Features

Amantys Gate Drives use the same power and fibre-optic interfaces as other commercial gate drives, but with the following benefits:

Product Selector

Amantys supplies on-module and off-module gate drives. Off-module gate drives require a module interface card (MIC) which adapts the gate drive to the specific form factor of the IGBT module. In the table below the MICs that are compatible with each gate drive or baseboard are listed.

The Gate Drive Technical Manual contains further information about the configuration options. It is suitable for all gate drives except the AE00NA8S which is not user configurable. The AD00XA8 has a dedicated technical manual, see the table below for information.

Part Number

Description (click part number for datasheet)

Compatible MICs
1200V    
AP12A Single On-module Gate Drive for HPM (limited configuration).  
AP12G Single On-module Gate Drive for HPM (full configuration).  
1700V    
AP17A Single On-module Gate Drive for HPM (limited configuration).  
AP17G Single On-module Gate Drive for HPM (full configuration).  
AE00NA8S Dual On-module Gate Drive for single nHPD2/LinPak, IGBT and +15V/-10V SiC MOSFET. This product does not have user configurable features. No TVS over-voltage clamp.

 
AP0xB Dual Core Baseboard with 1700V Module Interface Card for nHPD2, LinPak, LV100, IGBT and SiC MOSFET. Up to three modules in parallel with cables.Specify at order time if you need adjustable gate voltage for use with SiC modules.

XC000070 (nHPD2/LinPak)

(XC000072 (LV100)
AV17

Dual Core Assembly with distribution board and n-way module interface card (MIC) for nHPD2, LinPak, LV100, IGBT and SiC MOSFET. Up to 6 modules in parallel. The assembly mounts on top of the modules so no cables. Refer to datasheet and table below for number of ways and module spacing.

Specify at order time if you need adjustable gate voltage for use with SiC modules.

 

XB000089-02 (2-way nHPD2/LinPak, no spacing)

XB000090-02 (3-way nHPD2/LinPak, no spacing)

XB000091-01 (2-way LV100, 40mm spacing)

XB000095-01 (4-way nHPD2/LinPak, 4mm spacing)

XB000100-01 (3-way LV100, 10mm spacing)

XB000104-01 (6-way nHPD2/LinPak, no spacing)

XB000105-01 (5-way nHPD2/LinPak, no spacing)

XB000108-01 (3-way nHPD2/LinPak, 2mm spacing)

XB000114-01 (6-way LV100, 1.8mm spacing)

XB000115-01 (3-way LV100, 1.8mm spacing)

XB000118-01 (3-way nHPD2/LinPak, 10mm spacing)
3300V    
AP33A Single On-module Gate Drive for HPM (full configuration).  
AD00XA8 Single Off-module Gate Drive (InPower replacement) - single level clamp and no measurement of Vge or Vce. Refer to the AD00XA8 Technical Manual. XB000093-01 (LV HPM)
AE00NA8S Dual On-module Gate Drive for single nHPD2/LinPak, IGBT and +15V/-10VSiC MOSFET. This product does not have user configurable features. No TVS over-voltage clamp.

 
AP0xB

Dual Core Baseboard with 3300V Module Interface Card for XHP3, nHPD2, LinPak, LV100, IGBT and SiC MOSFET. Up to three modules in parallel with cables.

Specify at order time if you need adjustable gate voltage for use with SiC modules.

XC000026 (nHPD2/LinPak)

XC000097 (XHP3)

XC000071 (LV100)
AV33

Dual Core Assembly with distribution board and n-way module interface card (MIC) for nHPD2, LinPak, LV100, IGBT and SiC MOSFET. Up to 6 modules in parallel. The assembly mounts on top of the modules so no cables. Refer to datasheet and table below for number of ways and module spacing.

Specify at order time if you need adjustable gate voltage for use with SiC modules.

 

XB000089-02 (2-way nHPD2/LinPak, no spacing)

XB000090-02 (3-way nHPD2/LinPak, no spacing)

XB000091-01 (2-way LV100, 40mm spacing)

XB000095-01 (4-way nHPD2/LinPak, 4mm spacing)

XB000100-01 (3-way LV100, 10mm spacing)

XB000104-01 (6-way nHPD2/LinPak, no spacing)

XB000105-01 (5-way nHPD2/LinPak, no spacing)

XB000108-01 (3-way nHPD2/LinPak, 2mm spacing)

XB000114-01 (6-way LV100, 1.8mm spacing)

XB000115-01 (3-way LV100, 1.8mm spacing)

XB000118-01 (3-way nHPD2/LinPak, 10mm spacing)
4500V    
AP00J Single Core Baseboard with 4500V Module Interface Card for HPM. Requires DC-DC Converter. Up to three modules in parallel. XC000042 (HV HPM)
6500V    
AP00J Single Core Baseboard with 6500V Module Interface Card for HPM. Requires DC-DC Converter. Up to three modules in parallel. XC000040 (HV HPM)
DC-DC    
AS00D High Voltage Isolation DC-DC Converter for 4500V and 6500V Single Core Baseboard.